Intel will help the US military develop various chips | |
| |
Intel declined to disclose the amount of the contract, which is overseen by the Crane Division of the Navy's ground combat operations Center. Recall that Intel also managed to get the right to participate in the first phase of the project in 2019. Under the new contract, Intel will help the military develop prototype chips using its own semiconductor packaging technology at factories in Arizona and Oregon. The project is funded under the "Trusted and Assured Microelectronics program". At the second stage, prototypes of multi-chip packages will be developed and the promotion of interface, Protocol, and security standards for heterogeneous systems will be accelerated. Heterogeneous packaging technology allows you to combine chip elements called "chiplets" from different vendors into a single product to improve performance while reducing power consumption, size, and weight. SHIP provides the US government with access to Intel's advanced heterogeneous bundling technologies, including EMIB (embedded multi-die interconnect bridge), Foveros multi-layer 3D layout technology, and Co-EMIB (combining EMIB and Foveros). SHIP prototypes will combine special chips created by government organizations with advanced, commercially available Intel silicon products, including field-programmable gate arrays (FPGAs), specialized integrated circuits and processors. | |
| Category: Business | Views: 267 | | |
| Total comments: 0 | |
No entries.